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Sub-Micron Die Bonder
University of Sheffield · Education
In brief
University of Sheffield has announced plans to buy laboratory equipment work. This is an early notice: there is nothing to bid on yet, but it tells you a tender may follow.
The estimated value is £380,000 including VAT.
The contract runs for 4 weeks, starting 2 March 2026.
The buyer says it is suitable for small and medium-sized businesses.
Built from the notice's own fields. Always check the official notice before you bid.
Can I win this?
Competition
Usually low: a median of 1 bid per contract for this buyer (from 6 awards in the last 12 months).
What the notice says
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
How to bid
- Read the full notice on Find a Tender, including any tender documents it links to.
- Register your organisation on the Central Digital Platform (through Find a Tender) if you have not already. Suppliers need to be registered to take part in procurements under the Procurement Act 2023.
- Follow the submission instructions in the notice; it does not name an e-tendering portal.
Timeline
- Preliminary market engagement notice · UK2, notice 081169-2025
About the buyer
University of SheffieldLast 12 months
Procurements
22Awards
8Suppliers it has used most for laboratory equipment
- 3D GB IRE Ltd1 contract
- Bioinicia Fluidnatek S.L.1 contract
- Loop Technology Limited1 contract
- Optics11 Life B.V1 contract
Similar open tenders
All open laboratory equipment tenders- £1.06bnframework ceiling
- £251kestimated
From notice 081169-2025 on Find a Tender, first published 9 December 2025. We last checked for changes on 28 September 2026.