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Supply, Delivery and Installation Sinter Bonding Capability

University of Strathclyde · Education

In brief

University of Strathclyde has announced plans to buy laboratory equipment work. This is an early notice: there is nothing to bid on yet, but it tells you a tender may follow.

The notice does not state a value.

Built from the notice's own fields. Always check the official notice before you bid.

Can I win this?

Competition

Usually high: a median of 6 bids per contract for this buyer (from 6 awards in the last 12 months).

What the notice says

National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.

How to bid

  1. Read the full notice on Find a Tender, including any tender documents it links to.
  2. Follow the submission instructions in the notice; it does not name an e-tendering portal.

Timeline

  1. Prior information notice · notice 066666-2025

About the buyer

Procurements

90

Awards

46

Suppliers it has used most for laboratory equipment

  • SENTECH Instruments GmbH2 contracts
  • Inseto UK Limited1 contract
  1. Heating, Electrical, Mechanical and Decarbonisation Framework

    Eastern Procurement LimitedNorth East, North West, Yorkshire and the Humber, East Midlands, West Midlands, East of England, London, South East, South West, Wales, ScotlandEnergy and utilities, Construction

    Open22 days leftSuitable for SMEsFramework

    £1.06bnframework ceiling

From notice 066666-2025 on Find a Tender, first published 20 October 2025. We last checked for changes on 28 September 2026.